Please use this identifier to cite or link to this item:
https://er.knutd.edu.ua/handle/123456789/17000
Title: | Ti-Si-C in-situ composite as a potencial material for lightweight SOFC interconnects |
Other Titles: | Ti-Si-C in-situ композит як потенційний матеріал для з’єднувальних елементів облегшених ТОПК |
Authors: | Podhurska, V. Brodnikovskyi, D. Vasyliv, B. Gadzyra, M. Tkachenko, S. Čelko, L. Ostash, O. Brodnikovska, I. Brodnikovskyi, Ye. Vasylyev, O. |
Issue Date: | 2020 |
Citation: | Ti-Si-C in-situ composite as a potencial material for lightweight SOFC interconnects = Ti-Si-C in-situ композит як потенційний матеріал для з’єднувальних елементів облегшених ТОПК [Текст] / V. Podhurska, D. Brodnikovskyi, B. Vasyliv, M. Gadzyra, S. Tkachenko, L. Čelko, O. Ostash, I. Brodnikovska, Ye. Brodnikovskyi, O. Vasylyev // Promising materials and processes in applied electrochemistry – 2020 : monograph / ed.: V. Z. Barsukov, Yu. V. Borysenko, V. G. Khomenko, O. V. Linyucheva ; editor-in-chief V. Z. Barsukov. - Kyiv : KNUTD, 2020. - С. 54-68. |
Source: | Promising materials and processes in applied electrochemistry – 2020 |
URI: | https://er.knutd.edu.ua/handle/123456789/17000 |
Appears in Collections: | Наукові публікації (статті) |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
Promising_2020_P054-068.pdf | 2,88 MB | Adobe PDF | View/Open |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.